JPH0141033B2 - - Google Patents
Info
- Publication number
- JPH0141033B2 JPH0141033B2 JP1270082A JP1270082A JPH0141033B2 JP H0141033 B2 JPH0141033 B2 JP H0141033B2 JP 1270082 A JP1270082 A JP 1270082A JP 1270082 A JP1270082 A JP 1270082A JP H0141033 B2 JPH0141033 B2 JP H0141033B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- lead pins
- lead
- lead pin
- plate material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005219 brazing Methods 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 31
- 239000004065 semiconductor Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 15
- 239000002131 composite material Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000000945 filler Substances 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 230000002950 deficient Effects 0.000 description 6
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1270082A JPS58130548A (ja) | 1982-01-29 | 1982-01-29 | 半導体用リ−ドピンの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1270082A JPS58130548A (ja) | 1982-01-29 | 1982-01-29 | 半導体用リ−ドピンの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58130548A JPS58130548A (ja) | 1983-08-04 |
| JPH0141033B2 true JPH0141033B2 (en]) | 1989-09-01 |
Family
ID=11812662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1270082A Granted JPS58130548A (ja) | 1982-01-29 | 1982-01-29 | 半導体用リ−ドピンの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58130548A (en]) |
-
1982
- 1982-01-29 JP JP1270082A patent/JPS58130548A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58130548A (ja) | 1983-08-04 |
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